Thermal Properties of the Very Low Thermal Conductivity Ternary Chalcogenide Cu 4 Bi 4 M 9 (M = S, Se) Journal May, 2020
Monte Carlo simulations of Cu/Ni–Si–Mn co-precipitation in duplex stainless steels Journal May, 2020
Internal short circuit and failure mechanisms of lithium-ion pouch cells under mechanical indentation abuse conditions:An experimental study Journal April, 2020
Root cause analysis and solutions for plastic gamma detector degradation in challenging environments—An overview Journal February, 2020
Synthesis, transport properties and electronic structure of p-type Cu 1+x Mn 2−x InTe 4 ( x = 0, 0.2, 0.3) Journal January, 2020
Micromechanical and microstructure analysis of strain-induced phenomena in ultrasonic additively-manufactured Al-6061 alloy Journal January, 2020