Optical Thin Film Characterization:
Filmetrics F50-UV Thin-Film Mapping System & Horiba Jobin Yvon UVISEL FUV-VIS-NIR Spectroscopic Ellipsometer
Metrology of thin films is critical to ensuring wafer or chip-scale devices or structures will be consistent with their intended design. Thickness of films, residual stress, and optical properties of films may all play an important role is a successful nanofabrication process. In the NRL cleanroom we have a large suite of characterization tools, with optical thin film characterization being integral to nanofabrication workflows. A Filmetrics reflectometer with wafer mapping capability is a rapid method of measuring transparent film thickness, and how it varies across a wafer.
Spectroscopic ellipsometry with the Horiba Jobin Yvon instrument offers even more insights into transparent and semitransparent film properties such as roughness and optical constants.
Specifications/Capabilities
Horiba Jobin Yvon UVISEL FUV-VIS-NIR Spectroscopic Ellipsometer
- Variable wavelength 210nm - 880nm (Xe lamp) thickness and refractive index of transparent and semi-transparent thin films from 1Å to 50 µm
- Surface and interface roughness
- Optical constants (n,k) for isotropic, anisotropic and graded films
Filmetrics F50-UV Thin-Film Mapping System
- Automated film thickness mapping across 4” wafer
- Wavelength 190nm - 1100nm
- Film Thickness 5nm – 40µm
